7. WHAT PROCESSES WILL BE USED?

1. Use of digital fabrication processes: 
	- 3D printing of complex components not found in market
	- Laser Cutting panels and arrangements
	- Precision Milling of both PCB and other materials
	- Vinyl Cutting Graffiti designed in Photoshop for Skylight treatment of Container design
2. Design
	-Spatial arrangement of complex components into a compact state in 3D
	-Mechatronics
	
3. Electronics
	-Personally designed arduino compatible board
	-Quadra-Design for PCBs capable of incorporating seperate board designs in compact states
	
		3.1 Input Device
			-Infra Red Sensor Module
		3.2 Output Device
			-Buzzer and high intensity LED

4. Embedded Programming
	- All programming through IDE and GIT bash with FAB ISP
5. Moulding-Casting
	-Container wall panel insignia design  with a silicon cast covering.